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Thermal gap filler gel is a viscous substance with high thermal conductivity that is widely used in thermal management systems of electronic devices.
Thermal interface gel eliminates air, a poor conductor of heat, by filling the tiny gaps between electronic components and radiators, thereby forming a continuous heat conduction channel, significantly improving heat conduction from heat source to heat dissipation The efficiency of the machine. Due to the viscous properties of thermally conductive gel, it can well fill irregular surfaces of various shapes to ensure maximum heat conduction.
The main function of thermal conductive gel is to improve heat conduction efficiency, enhance the stability and reliability of equipment, extend the life of electronic equipment, and reduce noise.
Typical Products:
- BLT: 70-180μm (Bubble size)
- Color: Light Blue,Pink or Black(Bubble color)
|
Products |
Appearance |
Flow Rate g/min |
Specific Gravity |
BLT μm |
Thermal Conductivity W/(m-K) |
Features |
|
N-Sil 8735B |
Black |
80 |
3.2 |
76 |
3.7 |
Excellent processability |
|
N-Sil8745 |
Pink |
75 |
3.4 |
70 |
4.6 |
Printable gel |
|
N-Sil 8745B |
Black |
60 |
3.2 |
70 |
4.2 |
High flow rate High reliability |
|
N-Sil8745H |
Pink |
45 |
3.4 |
75 |
4.6 |
Anti-sagging Anti-spilling |
|
N-Sil 8762 |
Light Blue |
16 |
3.5 |
130 |
6.0 |
High thermal conductivity |
|
N-Sil8780 |
Light Blue |
15 |
3.3 |
180 |
8.0 |
High thermal conductivity |
Performance Features
Thermal conductive gel has high flexibility and still maintains a certain degree of softness after curing. It is suitable for use in electronic equipment that needs to withstand mechanical vibration or thermal expansion. Its low stress application properties help protect sensitive electronic components and is reusable for devices that are removable or require maintenance.
Thermal Impedane under various condition aging test
no obvious change (≤10%)can be found after 1000h under varied aging tests.
Wet material without any void/crack/slipping after 1000h under varied aging tests
- 85C/85%RH
- 125oC high temperature aging test
Gap between Anodized Aluminum and Glass
Automotive Thermal Gel
Thermal conductive gel is widely used in computers and servers, communication equipment, LED lighting, automotive electronics, medical electronics, household appliances, instrumentation, electrical engineering, new energy, security equipment, consumer electronics and other fields.
Thermal Gel VS Thermal Paste
Thermal grease and thermal gel are both important materials for thermal management of electronic devices. There are differences between thermal grease and thermal gel.
Form
- Thermal grease: Usually in a paste or flowing state, with a certain viscosity, easy to apply and construct.
- Thermal interface gel: It has a dense texture similar to plasticine and will not flow, but can be deformed by a certain pressure to adapt to the contact surface.
Application
- Thermal grease: Mainly used for heat dissipation of high-performance chips such as CPU and GPU, and also suitable for other electronic components that require efficient heat conduction.
- Thermal interface gel: Suitable for areas with large tolerances and uneven surfaces such as notebook video memory and power supply modules, as well as occasions that require durability and stability.
Performance
- Thermal grease: It has the characteristics of high thermal conductivity, good electrical insulation, low oil separation (tending to zero), and high and low temperature resistance.
- Thermal interface gel: In addition to high thermal conductivity, it also has excellent durability, stability and reliability.
In general, thermal grease is more suitable for heat dissipation of high-performance chips, while thermal gel is more suitable for occasions that require durability and stability. When choosing, the appropriate thermal conductive material should be selected according to the specific application scenario and requirements.
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